| Autor: |
Zwenger, Curtis, Scott, George, Baloglu, Bora, Jayaraman, Suresh, WonChul Do, WonGeol Lee, JiHun Yi |
| Předmět: |
|
| Zdroj: |
Advancing Microelectronics; Jan/Feb2018, Vol. 45 Issue 1, p6-9, 4p |
| Abstrakt: |
This paper reviews Silicon Wafer Integrated Fan-out Technology (SWIFT®) packaging methodology and its performance in a typical mobile application. In addition, the advantages of a SWIFT design are reviewed in comparison to a conventional competing 3D packaging technology. Package information, electrical simulation, and reliability test data will be presented to show how SWIFT technology is poised to provide robust, reliable, and low-cost 3D packaging solutions for advanced mobile products. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
|
