Autor:	Hakim, Edward B.
Předmět:	MICROELECTRONICS RELIABILITY in engineering TEMPERATURE SEMICONDUCTORS ENGINEERING COOLING
Zdroj:	Quality & Reliability Engineering International; Jul/Aug91, Vol. 7 Issue 4, p215-220, 6p
Abstrakt:	It is shown that microelectronic failures which occur within equipment operating temperature extremes are not dependent on absolute temperature! Therefore, tremendous equipment reductions can be made in size, weight and cost, and there will be an improvement in reliability by elimination of failures due to unreliable complex cooling systems. [ABSTRACT FROM AUTHOR]
Databáze:	Complementary Index
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