Interfacial Studies of a Metallurgical Bond Between "Activated" Ultrasonically Applied Solder and High Purity Fused Silica.

Autor: Shacklette, Lawrence W., Gerrity, Donna L., Lange, Michael R., Beachboard, James C., Smith, Ronald
Zdroj: Proceedings of SPIE; 5/28/2017, Vol. 10372, p1-8, 8p
Databáze: Complementary Index