| Autor: |
Markondeya Raj, P., Sharma, Himani, Sitaraman, Srikrishna, Mishra, Dibyajat, Tummala, Rao |
| Předmět: |
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| Zdroj: |
Proceedings of the IEEE; Dec2017, Vol. 105 Issue 12, p2330-2346, 17p |
| Abstrakt: |
The emergence of smartphones and other smart systems is driving new trends in electronics scaling that goes beyond transistors or active devices, to include all the system components such as packaging substrates, passive components, thermal structures, power sources, and the system interconnections. Current system components are at milliscale, creating a 10^3 to 10^6 scaling gap with the packaging interfaces at microscale, and transistors at nanodimensions. With current microstructured materials, component miniaturization also degrades performance metrics such as efficiency, tolerance or precision, thermal and frequency stability. Nanostructured materials and processes can potentially miniaturize these system components, while simultaneously enhancing the performance. These nanostructured components are assembled close to the active devices, resulting in ultraminiaturized and ultrathin systems with 3-D integration of passives with actives. This paper shows the impact of nanostructured materials toward enhancing the performance and miniaturization of power and radio-frequency (RF) passive components in emerging smart systems. Opportunities for nanostructured materials in improving the power density and efficiency of capacitors and inductors in power-supply modules are reviewed in the first part of the paper. The impact of nanostructured magnetic, dielectric and magneto-dielectric films on emerging RF subsystems is illustrated in the last part of the paper. [ABSTRACT FROM PUBLISHER] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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