INVESTIGATION OF ADSORPTION BEHAVIOR OF SMOOTHING ADDITIVES IN COPPER PLATING ELECTROLYTES.

Autor:	Sknar, I., Petrenko, L., Cheremysinova, А., Plyasovskaya, K., Kozlov, Ya., Amirulloyeva, N.
Předmět:	ADSORPTION (Chemistry) ADDITIVES COPPER plating ELECTROLYTES PHYSIOLOGICAL effects of surface active agents
Zdroj:	Eastern-European Journal of Enterprise Technologies; 2017, Vol. 2 Issue 11, p43-49, 7p
Databáze:	Complementary Index
Externí odkaz:	Zobrazit plný text záznamu