A folded leg Ka-band RF MEMS shunt switch with amorphous silicon (a-Si) sacrificial layer.

Autor:	Demirel, Kaan, Yazgan, Erdem, Demir, Şimşek, Akın, Tayfun
Předmět:	MICROELECTROMECHANICAL systems AMORPHOUS silicon FABRICATION (Manufacturing) ELECTRIC switchgear HEAT treatment MICROMACHINING
Zdroj:	Microsystem Technologies; May2017, Vol. 23 Issue 5, p1191-1200, 10p
Abstrakt:	Design and fabrication of a folded leg Ka-band RF micro electro mechanical systems (RF MEMS) is presented. The mechanical design is carried out to observe minimum permanent deformation on the MEMS bridge after our in-house MEMS packaging process temperature treatment (200 °C). On the other hand, the actuation voltage is aimed as <30 V and measured as 24-25 V before thermal treatment. Moreover, the switch shows 28-29 V actuation voltage after thermal treatment. The fabricated switch shows −0.4 dB insertion loss for the up state position at Ka-band, before and after heat treatment. The switch is fabricated on quartz wafer using an in-house surface micromachining process with a new amorphous silicon sacrificial layer structure. [ABSTRACT FROM AUTHOR]
Databáze:	Complementary Index
Externí odkaz:	Zobrazit plný text záznamu Full text from SpringerLink