Direct Cu to Cu Bonding and Other Alternative Bonding Techniques in 3D Packaging.
| Autor: | Suga, Tadatomo, He, Ran, Vakanas, George, La Manna, Antonio |
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| Zdroj: | 3D Microelectronic Packaging; 2017, p129-155, 27p |
| Databáze: | Complementary Index |
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