High Quality Cu Deposits from Cu Electroplating Baths.
| Autor: | Thorseth, Matthew, Scalisi, Mark, Prange, Jonathan, Inho Lee, Yil-Hak Lee, Jong-Hun An, Su-Han Woo, Yoon Joo Kim, Lefebvre, Mark, Calvert, Jeff |
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| Zdroj: | Advancing Microelectronics; Jan/Feb2017, Vol. 55 Issue 1, p6-8, 3p, 6 Black and White Photographs, 1 Graph |
| Abstrakt: | The article discusses microelectronics industry, including information on copper electroplating baths, copper deposits, and copper pillars. |
| Databáze: | Complementary Index |
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