Simulation and experimental study of Cu wedge bond reliability.
| Autor: | Xu, Tao, Li, Jin, Fu, Jason, Luechinger, Christoph |
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| Zdroj: | 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials & Packaging (EMAP) Conference; 2016, p1-6, 6p |
| Databáze: | Complementary Index |
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