Design and characterization of thermal conductive wafer coating in thin small outline package for automotive product application.
| Autor: | Hamid, Azhar Abdul, Periathamby, Dhanapalan, Azizan, Suhaimi, Tan, Chee Eng, Nadarajan, Siva Kumar S. |
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| Zdroj: | 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials & Packaging (EMAP) Conference; 2016, p1-5, 5p |
| Databáze: | Complementary Index |
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