QFN challenges: Second bond improvement to eliminate the weak stitch (fish tail) failure mechanism on pre plated lead frame.

Autor: Fah, Jacky Lee Sinn, Sekaran, Sreetharan, Subarmaniyan, Rameish Rao, Yong, Camella Chee Guey
Zdroj: 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials & Packaging (EMAP) Conference; 2016, p1-6, 6p
Databáze: Complementary Index