Impact of ELD layers in mechanical properties of microbumps for 3D stacking.
| Autor: | Lin Hou, Derakhshandeh, Jaber, De Preter, Inge, Vandersmissen, Kevin, Rebibis, Kenneth June, Miller, Andy, Beyne, Eric, De Wolf, Ingrid |
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| Zdroj: | 2016 6th Electronic System-Integration Technology Conference (ESTC); 2016, p1-5, 5p |
| Databáze: | Complementary Index |
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