Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels.

Autor: Brunschwiler, Thomas, Mrossko, Raul, Keller, Jurgen, Ozsun, Ozgur, Schlottig, Gerd
Zdroj: 2016 6th Electronic System-Integration Technology Conference (ESTC); 2016, p1-6, 6p
Databáze: Complementary Index