Reliability of sputtered thin aluminium films under accelerated stress testing by vibration loading and modeling.
| Autor: | Wunderle, B., Onken, T., Heilmann, J., Silbernagl, D., Arnold, J., Bieniek, T., Pufall, R. |
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| Zdroj: | 2016 6th Electronic System-Integration Technology Conference (ESTC); 2016, p1-14, 14p |
| Databáze: | Complementary Index |
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