CupraEtch FH™: New advanced low-etch depth soldermask and photoresist pretreatment.
| Autor: | Gil-Ibanez, Thoms, M., Clicque, A., Huelsmann, T., Brooks, P., Hotz, S., Cho, W., Li, S., Zou, Y. |
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| Zdroj: | 2016 11th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2016, p235-238, 4p |
| Databáze: | Complementary Index |
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