Effect of electroless Ni-P thickness on EFTECH 64-Ni, EFTECH 64-Cu and C194-Ni bump.
| Autor: | Ong, Cheng-Guan, Lau, Kok-Tee, Zaimi, Muhammad, Afiq, Muhammad, Queck, Kian-Pin |
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| Zdroj: | 2016 11th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2016, p319-322, 4p |
| Databáze: | Complementary Index |
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