Comparison of Epoxy-Based Encapsulating Materials over Temperature and Strain Rate.

Autor: Khan, Amnah S., Wilgeroth, James, Balzer, Jens, Proud, William G.
Předmět:
Zdroj: AIP Conference Proceedings; 2017, Vol. 1793 Issue 1, p1-7, 7p, 1 Color Photograph, 1 Black and White Photograph, 2 Charts, 6 Graphs
Abstrakt: The highly insulating, adhesive and bonding properties of thermosetting epoxies, their ability to be injection moulded in an uncured state, as well as their presence in a wide number of composites, has resulted in their widespread use in both electrical and aerospace applications. There is thus a need to understand the compressive response of epoxies over the range of temperatures likely to be experienced within their working environment. The effects of varying strain rates and temperatures on an epoxy resin (Scotchcast 8) and an epoxy-based syntactic foam (Stycast 1090) were investigated. The samples were studied from -20 °C to +80 °C over a range of strain rates (10-4 - 10+3 s-1). Stress-strain data was obtained, with further analysis from high-speed images. Dynamic Mechanical Analysis (DMA) was also performed on the two materials. Data obtained from these experiments demonstrated key differences in the behaviour of the two materials, forming a basis for comparison with numerical simulations. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index