How to Better Quantify 3D Surface Warpage.
| Autor: | Hubble, Neil |
|---|---|
| Předmět: | |
| Zdroj: | Advancing Microelectronics; Sep/Oct2016, Vol. 43 Issue 5, p18-21, 4p |
| Abstrakt: | The article focuses on the concept of three dimentional surface warpage in microelectronics industry, and mentions that signed warpage gauge have different mathematical approach to the data set can be used as JEDEC Full Field Signed Warpage (JFFSW). |
| Databáze: | Complementary Index |
| Externí odkaz: |
|