Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder.
| Autor: | Ramli, M. I. I., Salleh, M. A. A. Mohd, Derman, M. N., Said, R. M., Saud, N. |
|---|---|
| Zdroj: | MATEC Web of Conferences; 10/7/2016, Vol. 78, p1-7, 7p, 1 Color Photograph, 2 Black and White Photographs, 1 Chart, 2 Graphs |
| Databáze: | Complementary Index |
| Externí odkaz: |
|