Transient thermal behavior of SOIC packages ? an optimization study.
| Autor: | Dogruoz, M. Baris, Abarhama, Mehdi, Shankaranb, Gokul V. |
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| Zdroj: | 2016 15th IEEE Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems (ITherm); 2016, p1083-1092, 10p |
| Databáze: | Complementary Index |
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