Properties and reliability of molybdenum-copper-composites for thermal management applications.
| Autor: | Seiss, M., Mrotzek, T., Hutsch, T., Knabl, W. |
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| Zdroj: | 2016 15th IEEE Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems (ITherm); 2016, p971-975, 5p |
| Databáze: | Complementary Index |
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