Aging induced evolution of the cyclic stress-strain behavior of lead free solders.
| Autor: | Nianjun Fu, Suhling, Jeffrey C., Mustafa, Muhannad, Lall, Pradeep |
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| Zdroj: | 2016 15th IEEE Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems (ITherm); 2016, p737-745, 9p |
| Databáze: | Complementary Index |
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