Trench first metal hardmask post-lithography novel rework process for defectivity and yield improvement.
| Autor: | Silvestre, Mary Claire, Gogna, Mukesh, Mahalingam, Anbu Selvam K M, Ramanathan, Eswar, Ordonio, Christopher, Schaller, John |
|---|---|
| Zdroj: | 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC); 2016, p446-450, 5p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|