10nm local interconnect challenge with iso-dense loading and improvement with ALD spacer process.
| Autor: | Ming He, Ordonio, Christopher, Chun Hui Low, Welti, Peter, Lobb, Granger, Clancy, Aleksandra, Shu, Jeff, Hamouda, Ayman, Stephens, Jason, Shah, Ketan, Chandrasekhar, Ashwini, Silvestre, Mary Claire, Periasamy, Prakash, Mahalingam, Anbu Selvam KM, Pal, Shyam, Child, Craig |
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| Zdroj: | 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC); 2016, p15-17, 3p |
| Databáze: | Complementary Index |
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