Autor: |
Roshchin, V., Dshkhunyan, V., Petukhov, I., Sen'chenko, K., Vagin, M. |
Předmět: |
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Zdroj: |
Russian Microelectronics; Sep2016, Vol. 45 Issue 5, p324-328, 5p |
Abstrakt: |
Physicochemical aspects of the electrochemical formation of vertical contact structures of the Sn-Ag peritectic composition for chipping integrated microcircuits by the inverted crystal method are considered. The layer-by-layer deposition of metals is investigated and the conditions of the vertical growth of the structures are determined. [ABSTRACT FROM AUTHOR] |
Databáze: |
Complementary Index |
Externí odkaz: |
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