| Autor: |
Li, Z., Li, G., Cheng, L., Huang, J. |
| Předmět: |
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| Zdroj: |
Journal of Materials Science: Materials in Electronics; Jun2016, Vol. 27 Issue 6, p6076-6087, 12p |
| Abstrakt: |
The influence of TiO addition on the interfacial reaction in Sn-3.0Ag-0.5Cu solder joints with the pad size of 200 µm was investigated in this study. The microstructure of the solder joints and the interfacial intermetallic layers were analyzed by scanning electron microscope. Results show that both the thickness and grain size of the intermetallic compound (IMC) decreases when TiO is added. The Sn-3.0Ag-0.5Cu-0.1TiO solder exhibits the most prominent effect in retarding interfacial IMC growth and refining IMC grain size. It is observed that the scallop morphology became more faceted in shape compared with the large size Cu/solder interface, where the CuSn grains appear to be round shape no matter the reflow time is long or short. The cause might be due to the change in interfacial energy between the molten solder and CuSn phase, which is highly correlated with the Cu concentration profile near the interface in the side of the liquid solder. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
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