Recent trends of package warpage and measurement metrologies.
Autor: | Wei Keat Loh, Kulterman, Ron, Fu, Haley, Tsuriya, Masahiro |
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Zdroj: | 2016 International Conference on Electronics Packaging (ICEP); 2016, p89-93, 5p |
Databáze: | Complementary Index |
Externí odkaz: |