Recent trends of package warpage and measurement metrologies.
| Autor: | Wei Keat Loh, Kulterman, Ron, Fu, Haley, Tsuriya, Masahiro |
|---|---|
| Zdroj: | 2016 International Conference on Electronics Packaging (ICEP); 2016, p89-93, 5p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|