Thermal and electrical co-design of a modular high-density single-phase inverter using wide-bandgap devices.
Autor: | Chung, Steven, Nasr, Miad, Guirguis, David, Otsuka, Masafumi, Poshtkouhi, Shahab, Li, David K. W., Palaniappan, Vishal, Romero, David, Amon, Cristina, Orr, Ray, Trescases, Olivier |
---|---|
Zdroj: | 2016 IEEE Applied Power Electronics Conference & Exposition (APEC); 2016, p1350-1357, 8p |
Databáze: | Complementary Index |
Externí odkaz: |