Numerical and experimental investigations on the hybrid bonding of Cu/Si?2 patterned surfaces using a cohesive model.

Autor: Sart, Clement, Estevez, Rafael, Fiori, Vincent, Lhostis, Sandrine, Parry, Guillaume, Gonella, Roberto
Zdroj: 2016 17th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2016, p1-8, 8p
Databáze: Complementary Index