Numerical and experimental investigations on the hybrid bonding of Cu/Si?2 patterned surfaces using a cohesive model.
Autor: | Sart, Clement, Estevez, Rafael, Fiori, Vincent, Lhostis, Sandrine, Parry, Guillaume, Gonella, Roberto |
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Zdroj: | 2016 17th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2016, p1-8, 8p |
Databáze: | Complementary Index |
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