A multi-scale simulation method to predict delamination and adhesion force in UV-nanoimprint lithography.

Autor: Zhong, Yinsheng, Kwok, Stephen. C. T., Yuen, Matthew. M. F.
Zdroj: 2016 17th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2016, p1-5, 5p
Databáze: Complementary Index