Intrinsic stress effects on the warpage of silicon substrate during thin film deposition, photolithography and etching processes.
| Autor: | Yao, WeiZhen, Belhenini, Soufyane, Roqueta, Fabrice, Pujos, Cyril, Bruno, Erwan, Gardes, Pascal, Tougui, Abdellah |
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| Zdroj: | 2016 17th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2016, p1-6, 6p |
| Databáze: | Complementary Index |
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