Epoxy encapsulation compounds with improved thermal shock and reversion resistance.
| Autor: | Bolger, Justin C., Morano, Silvio L. |
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| Zdroj: | 1975 EIC 12th Electrical/Electronics Insulation Conference; 1975, p266-269, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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