3.2 mΩcm² enhancement-mode GaN MOSFETs with breakdown voltage of 800 V.

Autor: Hisashi Saito, Miki Yumoto, Shigeto Fukatsu, Yosuke Kajiwara, Aya Shindome, Kohei Oasa, Yoshiharu Takada, Kunio Tsuda, Masahiko Kuraguchi
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Zdroj: Physica Status Solidi (C); May2016, Vol. 13 Issue 5/6, p332-335, 4p
Abstrakt: Enhancement-mode GaN metal-oxide-semiconductor field-effect transistors (MOSFETs) have been reported. We utilized the atomic layer deposition (ALD) method for the fabrication process of the gate dielectric, in order to suppress plasma damage and obtain high-quality dielectric film. In the fabricated devices, the specific on-state resistance of 3.2 mΩcm² and the breakdown voltage of 800 V were achieved. Moreover, a 10-year lifetime with a cumulative failure rate of 0.1% was guaranteed at over 20 V. This voltage was twice the operation voltage of 10 V. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index