| Autor: |
Golgovici, Florentina, Catrangiu, Adriana-Simona, Stoian, Andrei, Anicai, Liana, Visan, Teodor |
| Předmět: |
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| Zdroj: |
Journal of Electronic Materials; Jul2016, Vol. 45 Issue 7, p3629-3639, 11p |
| Abstrakt: |
Cathodic processes of direct co-reduction of Cu and Te ions on Pt electrode at 60°C were investigated using cyclic voltammetry and electrochemical impedance spectroscopy techniques. The ionic liquid as background electrolyte consisted of a mixture of choline chloride and ethylene glycol (ChCl-EG 1:2 mol ratio) in which 5-20 mM CuCl and 8 mM TeO were dissolved. The voltammograms exhibited the following successive cathodic processes: Cu/Cu reduction, Te underpotential deposition, simultaneous deposition of Cu metal and CuTe compound, and deposition of Te-rich CuTe compound at the most negative potentials (from −0.5 V to −0.8 V). Corresponding dissolution or oxidation peaks were recorded on the anodic branch. The voltammetric results were confirmed by electrochemical impedance spectra. Copper telluride films have been synthesized on platinum substrate via potentiostatic electrodeposition at 60°C. It was found from atomic force microscopy that CuTe film samples prepared from ChCl-EG + 5 mM CuCl + 8 mM TeO ionic liquid have high growth rates. The x-ray diffraction patterns of the deposited films from ChCl-EG + 10 mM CuCl + 8 mM TeO ionic liquid indicated the presence of a CuTe phase for film deposited at −0.7 V and a CuTe phase for film deposited at −0.6 V. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
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