At-Speed Testing of Inter-Die Connections of 3D-SICs in the Presence of Shore Logic.

Autor: Shibin, Konstantin, Chickermane, Vivek, Keller, Brion, Papameletis, Christos, Marinissen, Erik Jan
Zdroj: 2015 IEEE 24th Asian Test Symposium (ATS); 2015, p79-84, 6p
Databáze: Complementary Index