Formation of metal interconnects and their resistance-change behavior during tensile stretching for stretchable packaging applications.
| Autor: | Park, Donghyun, Park, Dae Ung, Han, Kee-Sun, Shin, Soo Jin, Oh, Hyun-Ah, Oh, Tae Sung, Choi, Jung-Yeol, Hynix, S K |
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| Zdroj: | 2016 Pan Pacific Microelectronics Symposium (Pan Pacific); 2016, p1-6, 6p |
| Databáze: | Complementary Index |
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