| Autor: |
Greywall, Dennis S., Busch, Paul A., Pardo, Flavio, Carr, Dustin W., Bogart, Gregory, Soh, Hyongsok T. |
| Předmět: |
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| Zdroj: |
Journal of Microelectromechanical Systems; Oct2003, Vol. 12 Issue 5, p708-712, 5p, 8 Black and White Photographs, 4 Diagrams, 5 Graphs |
| Abstrakt: |
This paper discusses a two-piece approach for fabricating two-dimensional (2-D) arrays of tilting MEMS mirrors with application in very-large optical cross-connect switches. In the new process, a two-sided etching of silicon-on-insulator (SOI) wafers is used to create crystalline mirrors on a first wafer that is later aligned and bonded to a separate wafer containing the activation electrodes, traces, and bond pads. The approach allows a very close spacing of mirror elements and a very simple design for the mechanical structures, and also greatly simplifies wire routing. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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