Planarization improvement using non-porous polishing pad in ILD CMP.
| Autor: | Che-Chin Yang, Kai En Lin, Wei-Nan Fang, Jian-Shiun Chen, Yi-Ching Wu, Yung-Chieh Kuo, Hung-Bo Lu |
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| Zdroj: | 2015 International Conference on Planarization/CMP Technology (ICPT); 1/1/2015, p1-3, 3p |
| Databáze: | Complementary Index |
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