CMP process optimization on temporary-bonded wafer for via-last through-silicon-via from backside.
| Autor: | Ren, Qin, Loh, Woon Leng, Chui, K., Mao, Ying Jun, Wickramanayanaka, Sunil |
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| Zdroj: | 2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC); 1/1/2015, p1-4, 4p |
| Databáze: | Complementary Index |
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