Investigation of vertical interposers for high frequency operation.

Autor: Lim, Wei Yi, Chang, Ka Fai, Raja, M. Kumarasamy, Low, Seow Meng, Goh, Jason, Arasu, M. Annamalai
Zdroj: 2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC); 1/1/2015, p1-4, 4p
Databáze: Complementary Index