Highly thermal conductive transparent die attach material for LEDs.
| Autor: | Zhang, Kai, Li, Jie, Zhang, Xinfeng, Yuen, Matthew Ming-Fai, Liu, Lisa, Lee, Yuhua, Ku, Cheng Sheng, Wan, Chuiming, Zeng, Zhaoming, David Xiao, Guowei |
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| Zdroj: | 2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC); 1/1/2015, p1-4, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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