Bond tool life improvement for large copper wire bonding.
| Autor: | Xu, Tao, Walker, Todd, Chen, Raymond, Fu, Jason, Luechinger, Christoph |
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| Zdroj: | 2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC); 1/1/2015, p1-5, 5p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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