Void formation in Cu-Sn Solid-Liquid Interdiffusion (SLID) bonding.
| Autor: | Aasmundtveit, Knut E., Luu, Thi-Thuy, Wang, Kaiying, Hoivik, Nils |
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| Zdroj: | 2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-6, 6p |
| Databáze: | Complementary Index |
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