eWLB package for millimeter wave application.
| Autor: | Huynh, Ngoc-Hoa, Saverio, Trotta, Wojnowski, Maciej, Haubner, Gerhard, Pahlke, Sebastian, Schmitt, Jean, Mayr, Helmut, Wurtele, Johann, Rueddenklau, Uwe, Nasr, Ismail, Bal, Jagjit Singh |
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| Zdroj: | 2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-5, 5p |
| Databáze: | Complementary Index |
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