Biased humidity degradation model for Cu-Al wire bonded contacts based on molding compound properties.
| Autor: | Mavinkurve, Amar, Rongen, Rene, van Soestbergen, Michiel, O'Halloran, Orla, Goumans, Leon, Farrugia, Mark Luke |
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| Zdroj: | 2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-10, 10p |
| Databáze: | Complementary Index |
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