Thermal improvement of plastic laminate based LED modules with embedded chips.

Autor: Munding, Andreas, Gruber, Martin, Both, Tino, Herfurth, Michael, Hammer, Thomas, Schweitzer, Dirk, Pressel, Klaus, Waldschick, Andreas, Baur, Elmar, Kaltenbacher, Axel
Zdroj: 2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-6, 6p
Databáze: Complementary Index