Thermal improvement of plastic laminate based LED modules with embedded chips.
Autor: | Munding, Andreas, Gruber, Martin, Both, Tino, Herfurth, Michael, Hammer, Thomas, Schweitzer, Dirk, Pressel, Klaus, Waldschick, Andreas, Baur, Elmar, Kaltenbacher, Axel |
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Zdroj: | 2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-6, 6p |
Databáze: | Complementary Index |
Externí odkaz: |