Flip-chip MEMS microphone package with small front-volume and large back-volume.
| Autor: | Walser, Sebastian, Siegel, Christian, Winter, Matthias, Loibl, Michael, Pahl, Wolfgang, Leidl, Anton, Feiertag, Gregor |
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| Zdroj: | 2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-5, 5p |
| Databáze: | Complementary Index |
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