Quantifying the thermal conductivity enhancement of percolating thermal underfills.
| Autor: | Burg, Brian R., Zurcher, J., Schlottig, G., Chen, X., Brunschwiler, T. |
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| Zdroj: | 2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-4, 4p |
| Databáze: | Complementary Index |
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