Lapping and polishing of different LTCC substrates for thin film applications.
| Autor: | Gutzeit, Nam, Fischer, Michael, Bartsch, Heike, Muller, Jens |
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| Zdroj: | 2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-4, 4p |
| Databáze: | Complementary Index |
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