MMIC chipset for 300 GHz indoor wireless communication.

Autor: Kallfass, I., Harati, P., Dan, I., Antes, J., Boes, F., Rey, S., Merkle, T., Wagner, S., Massler, H., Tessmann, A., Leuther, A.
Zdroj: 2015 IEEE International Conference on Microwaves, Communications, Antennas & Electronic Systems (COMCAS); 2015, p1-4, 4p
Databáze: Complementary Index